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Applied Science & Technology Full Text (H.W. Wilson)

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MAOA and mechanisms of panic disorder revisited: from bench to molecular psychotherapy.

• Authors : Reif, A; Richter, J; Straube, B

Subjects: PANIC disorders; AGORAPHOBIA; PSYCHOTHERAPY

• Source: Molecular Psychiatry. Jan2014, Vol. 19 Issue 1, p122-128. 7p.

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Sybolical Index Calculation For Linear Circuits.

• Authors : Clauß, C.; Schwarz, P.; Straube, B.

Subjects: DIFFERENTIAL-algebraic equations; WOLFRAM language (Computer program language)

• Source: Mathematical & Computer Modelling of Dynamical Systems. Jun2001, Vol. 7 Issue 2, p205. 10p.

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Ventromedial prefrontal cortex activity and pathological worry in generalised anxiety disorder.

• Authors : Via, E.; Fullana, M. A.; Goldberg, X.

Subjects: PREFRONTAL cortex; GENERALIZED anxiety disorder; PATHOLOGICAL physiology

• Source: British Journal of Psychiatry; Jul2018, Vol. 213 Issue 1, p437-443, 7p

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Applied Science & Technology Full Text (H.W. Wilson)

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Anticipating agoraphobic situations: the neural correlates of panic disorder with agoraphobia.

• Authors : Wittmann, A.; Schlagenhauf, F.; Guhn, A.

Subjects: BRAIN physiology; MAGNETIC resonance imaging; AGORAPHOBIAGERMANY

• Source: Psychological Medicine; Aug2014, Vol. 44 Issue 11, p2385-2396, 12p

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Toward verification of material handling systems.

• Authors : Klotz, T.; Straube, B.; Fordran, E.

• Source: 2011 9th IEEE International Conference on Industrial Informatics (INDIN); 2011, p218-223, 6p

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An approach to the verification of material handling systems.

• Authors : Klotz, T.; Straube, B.; Fordran, E.

• Source: 2011 IEEE 16th Conference on Emerging Technologies & Factory Automation (ETFA); 2011, p1-8, 8p

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Characterization of digital cells for statistical test.

• Authors : Hopsch, F.; Lindig, M.; Straube, B.

• Source: 2011 IEEE 14th International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS); 2011, p255-260, 6p

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Developing digital test sequences for through-silicon vias within 3D structures.

• Authors : Gulbins, M.; Hopsch, F.; Schneider, P.

• Source: 3D Systems Integration Conference (3DIC), 2010 IEEE International; 2010, p1-6, 6p

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