Search Results

Applied Science & Technology Full Text (H.W. Wilson)

Record details

Applied Science & Technology Full Text (H.W. Wilson)

Record details

Applied Science & Technology Full Text (H.W. Wilson)

Record details

Applied Science & Technology Full Text (H.W. Wilson)

Record details

Fracture Energy of an Aligned Porous Silicon Nitride.

• Authors : Inagaki, Yoshiaki; Ohji[*], Tatsuki; Kanzaki[*], Shuzo

Subjects: *POROUS silicon; *CERAMIC fracture; *SILICON nitride

• Source: Journal of the American Ceramic Society. Jul2000, Vol. 83 Issue 7, p1807. 3p. 2 Black and White Photographs, 1 Graph.

Record details

Additive manufacturing of complex-shaped and porous silicon nitride-based components for bionic bones.

• Authors : Huang, Shengwu¹ (AUTHOR); Yang, Ping^1,2 (AUTHOR) ; Sheng, Pengfei¹ (AUTHOR)

Subjects: *POROUS silicon; *SILICON nitride; *YOUNG'S modulus

• Source: Ceramics International. Aug2023, Vol. 49 Issue 15, p25025-25034. 10p.

Record details

A New Synthesis Method for Producing Si3N4 Whiskers by Heat Treating Porous Si Objects.

• Authors : Hanjun, Hu¹; Wan-cheng, Zhou¹; Fa, Luo¹

Subjects: *SILICON nitride; *POROUS silicon; *CHEMICAL vapor deposition

• Source: Journal of the American Ceramic Society. Nov2008, Vol. 91 Issue 11, p3800-3802. 3p. 2 Black and White Photographs, 2 Graphs.

Record details

长柱状晶多孔氮化硅毛细芯的孔隙 参数控制及性能研究.

• Authors : 朱保鑫; 王洪升; 盖 莹

Subjects: PORE size distribution; POROUS materials; POROUS silicon

• Source: Bulletin of the Chinese Ceramic Society; May2023, Vol. 42 Issue 5, p1858-1863, 6p

Record details

Effect of TMAH as a modifier on the performance of Si3N4 stereolithography pastes.

• Authors : Sun, Ning¹ (AUTHOR); Wang, Tengpeng¹ (AUTHOR); Du, Yuhang¹ (AUTHOR)

Subjects: *STEREOLITHOGRAPHY; *POROUS silicon; *SILICON nitride

• Source: Ceramics International. May2024:Part B, Vol. 50 Issue 9, p15502-15512. 11p.

Record details

The Effects of Porous Silicon and Silicon Nitride Treatments on the Electronic Qualities of Multicrystalline Silicon for Solar Cell Applications.

• Authors : Alrasheedi, Nashmi H.

• Source: SILICON (1876990X); Feb2024, Vol. 16 Issue 4, p1765-1773, 9p

Record details