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Semiconductor Dry Etching Innovation in the Era of 3D Monolithic Integration.

• Authors : Lill, Thorsten¹ (AUTHOR) ; Fischer, Andreas² (AUTHOR)

• Source: Interface. Dec2024, Vol. 33 Issue 4, p69-72. 4p.

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Non‐parametric local capability indices for industrial planar manufacts: An application to the etching phase in the microelectronic industry.

• Authors : Borgoni, Riccardo¹ (AUTHOR) ; Farace, Vincenzo Emanuele² (AUTHOR); Zappa, Diego³ (AUTHOR)

Subjects: *INTEGRATED circuits; *INDUSTRIAL goods; *MANUFACTURING processes

• Source: Applied Stochastic Models in Business & Industry. Sep2022, Vol. 38 Issue 5, p884-900. 17p.

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Technological Approaches for Formation of High-Density Integral Capacitors: Deep Etching and Atomic Layer Deposition.

• Authors : Miakonkikh, A.; Pankratov, S.; Kuzmenko, V.

Subjects: ATOMIC layer deposition; CAPACITORS; LITERATURE reviews

• Source: Russian Microelectronics; 2023 Suppl 1, Vol. 52, pS168-S175, 8p

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Applied Science & Technology Full Text (H.W. Wilson)

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Applied Science & Technology Full Text (H.W. Wilson)

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Nisene - A Division of Polymatech Electronics Launches Revolutionary Microwave-Induced Plasma Etching Technology in the U.S.

• Source: PR Newswire. 2024.

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Applied Science & Technology Full Text (H.W. Wilson)

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Controlled Stepwise Wet Etching of Polycrystalline Mo Nanowires.

• Authors : Saidov, Khakimjon^1,2,3 (AUTHOR); Erofeev, Ivan^2,3 (AUTHOR); Aabdin, Zainul⁴ (AUTHOR)

Subjects: *ETCHING; *COPPER; *ELECTRONIC equipment

• Source: Advanced Functional Materials. 3/18/2024, Vol. 34 Issue 12, p1-9. 9p.

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Understanding 3D anisotropic reactive ion etching of oxide-metal stacks.

• Authors : Golani, Prafful; Tirukkonda, Roshan J.; Fancher, Aaron N.

Subjects: SEMICONDUCTOR manufacturing; MOLYBDENUM; ETCHING

• Source: Journal of Vacuum Science & Technology: Part B-Nanotechnology & Microelectronics; Dec2023, Vol. 41 Issue 6, p1-11, 11p

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Reactive Ion Etching of X-Cut LiNbO 3 in an ICP/TCP System for the Fabrication of an Optical Ridge Waveguide.

• Authors : Kozlov, Andrei; Moskalev, Dmitrii; Salgaeva, Uliana

Subjects: PLASMA etching; ETCHING; PLASMA sources

• Source: Applied Sciences (2076-3417); Feb2023, Vol. 13 Issue 4, p2097, 14p

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