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HeiQ will become a private company again.

Subjects: *BOARDS of directors; *TECHNOLOGICAL innovations; CHEMICAL vapor depositionLONDON Stock Exchange

• Source: Outdoor Industry Compass. 10/30/2024, Vol. 17 Issue 4, pN.PAG-N.PAG. 1p.

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A hierarchical model-based method for wafer level virtual metrology under process information deficiency.

• Authors : Liu, Yu-Jun¹ (AUTHOR); Ni, Dong¹ (AUTHOR) ; Shao, Xiong² (AUTHOR)

Subjects: *SEMICONDUCTOR manufacturing; *INFORMATION processing; *VIRTUAL machine systems

• Source: Quality Engineering. 2024, Vol. 36 Issue 3, p534-547. 14p.

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Building microscopic parts.

Subjects: CHEMICAL vapor deposition

• Source: Futurist. May/Jun96, Vol. 30 Issue 3, p45. 2p. 1 Color Photograph, 3 Black and White Photographs.

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Management of TEOS LPCVD process effluents.

• Authors : Gu, Youfan; Dozoretz, Paul; Bhakta, Jay

Subjects: CHEMICAL vapor deposition; SILICA; SCIENTIFIC experimentation

• Source: Solid State Technology. Jul99, Vol. 42 Issue 7, p151. 4p. 2 Black and White Photographs, 3 Diagrams.

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A BETTER WAY TO PRODUCE thin-film prototypes.

• Authors : Leiby, Mark W.; Hoffman, Jean M.

Subjects: CHEMICAL vapor deposition; THIN films; METALLIC oxides

• Source: Machine Design. 2/20/2003, Vol. 75 Issue 4, p114. 3p. 2 Color Photographs, 1 Diagram.

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Sekisui and Chemitronics show nonvacuum plasma CVD equipment.

Subjects: *SEMICONDUCTOR industry; CHEMICAL vapor deposition; EQUIPMENT & suppliesCHEMITRONICS Co. ; SEKISUI Chemical Co. Ltd.

• Source: Solid State Technology. Mar2001, Vol. 44 Issue 3, p48. 2p.

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MOCVD BaSrTiO3 for...-Gbit DRAMs.

• Authors : Bilodeau, Steven M.; Carl, Ralph

Subjects: CHEMICAL vapor deposition; RANDOM access memory

• Source: Solid State Technology. Jul97, Vol. 40 Issue 7, p235. 5p. 1 Black and White Photograph, 2 Charts, 6 Graphs.

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Barrier and seed layers for damascene copper metallization.

• Authors : Chin, Barry; Ding, Peijun; Sun, Bingxi

Subjects: CHEMICAL vapor deposition; VAPOR-plating

• Source: Solid State Technology. Jul98, Vol. 41 Issue 7, p141. 4p. 5 Black and White Photographs, 1 Chart, 3 Graphs.

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High-throughput W/Ti barrier sequential deposition.

• Authors : Castan, Thierry; Peyre, Jean-Luc; Beschorner, Klaus

Subjects: CHEMICAL vapor deposition; BIPOLAR integrated circuits -- Design & construction

• Source: Solid State Technology. Jun98, Vol. 41 Issue 6, p127. 4p. 2 Black and White Photographs, 3 Diagrams, 1 Chart, 2 Graphs.

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PVD Aluminum Pigments: Superior Brilliance for Coatings & Graphic Arts.

• Authors : Seubert, Dr. Joerg; Fetz, Dr. Andrea

Subjects: PIGMENTS; CHEMICAL vapor deposition

• Source: Paint & Coatings Industry. Jun2000, Vol. 16 Issue 6, p40. 6p. 2 Color Photographs, 2 Black and White Photographs, 8 Diagrams, 2 Graphs.

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