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Academic Journal

Hierarchal Modeling of Creep Behavior of:SnAg Solder Alloys.

Subjects: CREEP (Materials); SOLDER & soldering; EUTECTICS

  • Source: Journal of Electronic Packaging; Sep2008, Vol. 130 Issue 3, p3041-3046, 6p, 9 Black and White Photographs, 1 Chart, 7 Graphs

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