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Automated inspection of OPC and PSC masks.

• Authors : Staud, Wolfgang; Huang, Karen

Subjects: *INTEGRATED circuits industryUNITED States

• Source: Solid State Technology. Jul97, Vol. 40 Issue 7, p161. 4p. 4 Diagrams, 2 Graphs.

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Value of semiconductor mergers and acquisitions falls considerably.

Subjects: *INTEGRATED circuits industry; *SALE of business enterprisesIC Insights Inc. IC Insights Inc. IC Insights Inc. 969793496 ; MICROSEMI Corp. MICROSEMI Corp. MICROSEMI Corp. MSCC; MICROCHIP Technology Inc. 186917969 MICROCHIP Technology Inc. MICROCHIP Technology Inc. 186917969 186917969 MICROCHIP Technology Inc. 186917969 MCHP

• Source: Solid State Technology. Jan/Feb2019, Vol. 62 Issue 1, p7-8. 2p.

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Infrastructure matures as Flip chip takes off.

• Authors : Vardaman, E. Jaw

Subjects: *INTEGRATED circuits industry; *TECHNOLOGY

• Source: Solid State Technology. Sep2001, Vol. 44 Issue 9, p47. 3p. 1 Color Photograph, 1 Graph.

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It's Europe's turn now.

• Authors : DeFerm, Ludo

Subjects: *SEMICONDUCTOR industry; *INTEGRATED circuits industryEUROPE

• Source: Solid State Technology. Apr2001, Vol. 44 Issue 4, Special section pS1. 3p. 3 Color Photographs.

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The Control of Oxygen Precipitation and the Impact of Internal Gettering.

Subjects: *INTEGRATED circuits industry; *MANUFACTURING processes

• Source: Solid State Technology. Mar2001, Vol. 44 Issue 3, p113. 2p. 1 Black and White Photograph, 1 Graph.

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1998 capital spending trends: Boom to bust.

• Authors : McClean, Bill

Subjects: *INTEGRATED circuits industry; *CAPITAL investments

• Source: Solid State Technology. Oct98, Vol. 41 Issue 10, p54. 4p.

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Smart sensors: The next evolutionary step in metrology.

• Authors : Tepermeister, Igor

Subjects: *INTEGRATED circuits industry

• Source: Solid State Technology. Mar97, Vol. 40 Issue 3, p168. 2p. 1 Black and White Photograph.

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Dielectric antireflective coatings for DUV lithography.

• Authors : Bencher, Christopher; Ngai, Chris

Subjects: *INTEGRATED circuits industry; LITHOGRAPHY

• Source: Solid State Technology. Mar97, Vol. 40 Issue 3, p109. 4p. 3 Black and White Photographs, 2 Diagrams, 5 Graphs.

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Wirebonding to multilevel metal.

• Authors : O'Neill, Peter M.; Eaton, Dennis H.

Subjects: WIRE bonding (Electronic packaging); INTEGRATED circuits industry

• Source: Solid State Technology. Nov97, Vol. 40 Issue 11, p87. 6p. 1 Color Photograph, 1 Black and White Photograph, 1 Diagram, 2 Graphs.

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Process Watch: Yield management turns green.

• Authors : PRICE, DAVID W.¹; SUTHERLAND, DOUGLAS G.²; SHERMAN, KARA L.³

Subjects: *INTEGRATED circuits industry; *PROCESS control systems; *ENVIRONMENTAL impact analysis

• Source: Solid State Technology. Jun2016, Vol. 59 Issue 4, p15-18. 4p.

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