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Applied Science & Technology Full Text (H.W. Wilson)

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Applied Science & Technology Full Text (H.W. Wilson)

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Copper pillar bump design optimization for lead free flip-chip packaging.

• Authors : Chen, K. M.; Lin, T. S.

Subjects: FINITE element method; GLASS transition temperature; METALLURGY

• Source: Journal of Materials Science: Materials in Electronics; Mar2010, Vol. 21 Issue 3, p278-284, 7p, 10 Diagrams, 5 Charts, 1 Graph

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Optical properties of nanocrystalline diamond films from mid-infrared to ultraviolet using reflectometry and ellipsometry.

• Authors : Hu, Z. G.; Prunici, P.; Hess, P.

Subjects: NANOCRYSTALS; OPTICAL properties; PHOTONS

• Source: Journal of Materials Science: Materials in Electronics; Oct2007 Supplement, Vol. 18, p37-41, 5p, 1 Chart, 4 Graphs

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Applied Science & Technology Full Text (H.W. Wilson)

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Applied Science & Technology Full Text (H.W. Wilson)

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Applied Science & Technology Full Text (H.W. Wilson)

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Applied Science & Technology Full Text (H.W. Wilson)

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Applied Science & Technology Full Text (H.W. Wilson)

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Applied Science & Technology Full Text (H.W. Wilson)

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