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SGM accurately measures ground impedance.

• Authors : Melcher, Jerry

Subjects: ELECTRIC impedance; ELECTRIC substations; ELECTRIC powerHOOD-Patterson & Dewar Inc.

• Source: Electric Light & Power. Mar1998, Vol. 76 Issue 3, p18. 2/3p. 1 Diagram.

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AMPERA'S CAPACITANCE.

Subjects: AMPERES; ELECTRIC capacity; ELECTRIC impedance

• Source: Power Engineering. Jan2001, Vol. 105 Issue 1, p72. 1/3p.

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Next-gen direct attach technology hinges on ribbonized configuration.

• Authors : Nippani, Kris¹; Tkazyik, William²

Subjects: SEMICONDUCTORS; ELECTRIC conductivity; ELECTRICAL conductors

• Source: Connector Specifier. May2007, Vol. 23 Issue 2, p14-15. 2p.

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A Game Changer for Wind Turbine Output?

• Authors : Blankinship, Steve

Subjects: *ELECTRIC power distribution; SUPERCONDUCTIVITY; ELECTRIC conductivityUNITED States

• Source: Power Engineering. Feb2009, Vol. 113 Issue 2, p10-10. 2/3p.

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Semiconductor Modeling Software.

Subjects: *MICROELECTRONICS; SEMICONDUCTORS; ELECTRIC conductivityCOVENTOR Inc.

• Source: Advanced Packaging. Apr2006, Vol. 15 Issue 4, p39-93. 1/5p.

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SiliconPipe announces high-speed interconnectivity with no package vias.

Subjects: *MANUFACTURING processes; *COST effectiveness; ELECTRONIC circuit designSILICONPIPE Inc.

• Source: Connector Specifier. Nov2005, Vol. 21 Issue 11, p4-9. 2p. 1 Diagram.

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What Defines An 'Environmentally Friendly' Package?

• Authors : Groover, Richard¹

Subjects: *MICROELECTRONICS; *SEMICONDUCTOR industry; *MICROELECTRONICS industry

• Source: Advanced Packaging. Nov2004 Supplement, Vol. 13, p8-8. 1p.

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Mechanical design tips for EMI shielding.

• Authors : Van Tienhoven, Jan¹

Subjects: ELECTROMAGNETIC interference; EFFECT of radiation on electronic apparatus & appliances; ELECTROMAGNETIC shielding

• Source: Control Solutions International. Feb2004, Vol. 77 Issue 2, p37-40. 4p. 1 Color Photograph, 9 Diagrams.

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Choosing the Best Bump for the Buck.

• Authors : Collier, Terence Q.¹

Subjects: *SEMICONDUCTOR industry; SEMICONDUCTOR wafers; TAPS & dies

• Source: Advanced Packaging. May/Jun2008, Vol. 17 Issue 4, p23-27. 3p.

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