FOSTERING THE FUTURE.

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  • Additional Information
    • Subject Terms:
      FLEXIBLE Packaging Association (Washington, D.C.)
    • Abstract:
      The article provides information on the Flexible Packaging Academic Scholarship and Summer Internship Program from the Flexible Packaging Association. The program is considered a viable platform to meet the challenges of how to find and develop the next generation of leaders and contributors to the success of flexible packaging. It has provided hands-on, career building internships to packaging and printing school students.