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Henkel, Shanghai University Form Electronics Analysis Center.
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- Author(s): Drysdale, Chelsey
- Source:
Circuits Assembly. Aug2008, Vol. 19 Issue 8, p10-10. 1/5p.
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- Additional Information
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- Abstract:
The article reports on the agreement entered among Henkel, Shanghai University and other research universities to form a Shanghai Region Joint Electronics Research and Failure Analysis Center. Among the plans of the said project are the study of the interfacial bonding mechanisms between metals and organic polymers, new latent curing systems for advanced electronics polymer applications, fundamental studies of the rheological behavior of microelectronic assembly materials, nanocomposite microelectronic packaging materials and advanced microelectronic thermal solutions.
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