Instadeep.

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    • Abstract:
      The article "New Packaging" reports on the collaboration between Instadeep and Google Cloud to launch the enhanced version of their AI-powered PCB tool, Deep PCB Pro. The tool automates design tasks for printed circuit boards, allowing engineers to work faster and more efficiently. By utilizing artificial intelligence and reinforcement learning techniques, the tool optimizes the design process and reduces design cycles for faster product development. Instadeep is part of the BioNTech Group and collaborates with partners such as Deep Mind, Nvidia, and Google Cloud. [Extracted from the article]
    • Abstract:
      Der Artikel "Neue Verpackung" berichtet über die Zusammenarbeit von Instadeep mit Google Cloud zur Einführung der erweiterten Version ihres KI-gestützten PCB-Tools, Deep PCB Pro. Das Tool automatisiert Designaufgaben für Leiterplatten, was Ingenieuren ermöglicht, schneller und effizienter zu arbeiten. Durch die Nutzung von künstlicher Intelligenz und Reinforcement-Learning-Techniken optimiert das Tool den Designprozess und reduziert die Designzyklen für eine schnellere Produktentwicklung. Instadeep ist Teil der BioNTech Group und arbeitet mit Partnern wie Deep Mind, Nvidia und Google Cloud zusammen. [Extracted from the article]
    • Abstract:
      Copyright of Neue Verpackung is the property of Hüthig GmbH and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)