Microfluidic method–based encapsulated phase change materials: Fundamentals, progress, and prospects.

Encapsulating phase change materials (PCMs) in protective shells can reversibly absorb and release large amounts of heat within a narrow range of operating temperatures and address leakage during the phase transition process. Thus, encapsulated PCMs have attracted significant attention in thermal management. However, their poor thermal properties, unstable physical properties, and non-tunable chemical properties limit their real-world applications. The microfluidic method offers the precise and tunable control of encapsulation, enabling the fabrication of efficient and stabilized PCMs with the desired properties. This review comprehensively summarizes the recent advances in microfluidic method-based encapsulated PCMs (ME-PCMs). Microfluidic method–based technologies for the fabrication of ME-PCM capsules and ME-PCM fibers are highlighted, and the applications of ME-PCMs in thermal regulation, thermal response, and wearable electronics are examined. In addition, we provide insights on future directions for large-scale applications, and we believe that this review can inspire researchers to devise novel and effective encapsulation methods for ME-PCMs. • The significance and characteristics of current encapsulated PCMs are reviewed. • The potential microfluidic methods for the fabrication of ME-PCMs are discussed. • The recent advances in ME-PCM capsule and fiber research are highlighted. • Applications, existing challenges, and future development strategies are discussed. [ABSTRACT FROM AUTHOR]

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